20 0 5 -0 2 - 17 rev. 2. 0 page 1 sdb06s60 thinq! sic schottky diode silicon carbide schottky diode ? worlds first 600v schottky diode ? revolutionary semiconductor material - silicon carbide ? switching behavior benchmark ? no reverse recovery ? no temperature influence on the switching behavior ? ideal diode for power factor correction up to 1200w 1) ? no forward recovery product summary v rrm 600 v q c 21 nc i f 6 a d2pak pin 1 pin 2 type package ordering code sdb06s60 d2pak q67040-s4370 pin 3 marking d06s60 n.c. c a maximum ratings , at t j = 25 c, unless otherwise specified parameter symbol value unit continuous forward current, t c =100c i f 6 a rms forward current , f =50 hz i frms 8.4 surge non repetitive forward current, sine halfwave t c =25c, t p =10ms i fsm 21.5 repetitive peak forward current t j =150c, t c =100c, d =0.1 i frm 28 non repetitive peak forward current t p =10s, t c =25c i fmax 60 i 2 t value , t c =25c, t p =10ms 3 i 2 d t 2.3 a2s repetitive peak reverse voltage v rrm 600 v surge peak reverse voltage v rsm 600 power dissipation , t c =25c p tot 57.6 w operating and storage temperature t j , t stg -55... +175 c
200 5 -0 2 - 17 rev. 2. 0 page 2 sdb06s60 thermal characteristics parameter symbol values unit min. typ. max. characteristics thermal resistance, junction - case r thjc - - 2.6 k/w thermal resistance, junction - ambient, leaded r thja - - 62 smd version, device on pcb: p-to263-3-2: @ min. footprint p-to263-3-2: @ 6 cm 2 cooling area 2) p-to252-3-1: @ min. footprint p-to252-3-1: @ 6 cm 2 cooling area 2) r thja - - - - - 35 - - 62 - 75 50 electrical characteristics , at t j = 25 c, unless otherwise specified parameter symbol values unit min. typ. max. static characteristics diode forward voltage i f =6a, t j =25c i f =6a, t j =150c v f - - 1.5 1.7 1.7 2.1 v reverse current v r =600v, t j =25c v r =600v, t j =150c i r - - 20 50 200 1000 a 1 ccm, v in = 85vac, t j = 150c, t c =100c, = 93%, ? i in = 30% 2 device on 40mm*40mm*1.5mm epoxy pcb fr4 with 6cm2 (one layer, 70 m thick) copper area for drain connection. pcb is vertical without blown air.
200 5 -0 2 - 17 rev. 2. 0 page 3 sdb06s60 electrical characteristics , at t j = 25 c, unless otherwise specified parameter symbol values unit min. typ. max. ac characteristics total capacitive charge v r =400v, i f =6a, d i f /d t =200a/s, t j =150c q c - 21 - nc switching time v r =400v, i f =6a, d i f /d t =200a/s, t j =150c t rr - n.a. - ns total capacitance v r =0v, t c =25c, f =1mhz v r =300v, t c =25c, f =1mhz v r =600v, t c =25c, f =1mhz c - - - 300 20 15 - - - pf
200 5 -0 2 - 17 rev. 2. 0 page 4 sdb06s60 1 power dissipation p tot = f ( t c ) 0 20 40 60 80 100 120 140 c 180 t c 0 5 10 15 20 25 30 35 40 45 50 w 60 p tot 2 diode forward current i f = f ( t c ) parameter: t j 175 c 0 20 40 60 80 100 120 140 c 180 t c 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 a 6.5 i f 4 typ. forward power dissipation vs. average forward current p f(av) = f ( i f ) t c =100c, d = t p / t 0 2 4 6 8 a 12 i f(av) 0 2 4 6 8 10 12 14 16 18 20 22 24 w 28 p f(av) d=0.1 d=0.2 d=0.5 d=1 3 typ. forward characteristic i f = f ( v f ) parameter: t j , t p = 350 s 0 0.5 1 1.5 v 2.5 v f 0 1 2 3 4 5 6 7 8 9 10 a 12 i f 150c 125c 100c 25c -40c
200 5 -0 2 - 1 7 rev. 2. 0 page 5 sdb06s60 5 typ. reverse current vs. reverse voltage i r = f ( v r ) 100 150 200 250 300 350 400 450 500 v 600 v r -3 10 -2 10 -1 10 0 10 1 10 2 10 a i r 150c 125c 100c 25c 6 transient thermal impedance z thjc = f ( t p ) parameter : d = t p / t 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p -4 10 -3 10 -2 10 -1 10 0 10 1 10 k/w sdp06s60 z thjc single pulse 0.01 0.02 0.05 0.10 0.20 d = 0.50 7 typ. capacitance vs. reverse voltage c = f ( v r ) parameter: t c = 25 c, f = 1 mhz 10 0 10 1 10 2 10 3 v v r 0 50 100 150 pf 250 c 8 typ. c stored energy e c = f ( v r ) 0 100 200 300 400 v 600 v r 0 0.5 1 1.5 2 2.5 j 3.5 e c
200 5 -0 2 - 1 7 rev. 2. 0 page 6 sdb06s60 9 typ. capacitive charge vs. current slop e q c = f ( d i f /d t ) parameter: t j = 150 c 100 200 300 400 500 600 700 800 a/s 1000 d i f /d t 0 2 4 6 8 10 12 14 16 18 nc 22 q c i f *0.5 i f i f *2
sdb06s60 pg-to220-3-45 (d2pak): outline rev. 2.0 page 7 2005-02-17 dimensions in mm/inches rev. 2.0 page 7 2005-02-17
200 5 -0 2 - 1 7 rev. 2. 0 page 8 sdb06s60 published by infineon technologies ag , bereichs kommunikation st.-martin-strasse 53, d-81541 mnchen ? infineon technologies ag 1999 all rights reserved. attention please! the information herein is given to describe certain components and shall not be considered as warranted characteristics. terms of delivery and rights to technical change reserved. we hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. infineon technologies is an approved cecc manufacturer. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologies office in germany or our infineon technologies reprensatives worldwide (see address list). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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